Our EXEcutive team

Bryan Black is responsible for driving the Chipletz company vision, strategy, and execution. Formerly a Senior Fellow at AMD, Bryan led the technology developments leading to the multi-chip module and stacked die products across the company's portfolio, including the design of high-bandwidth memory (HBM) and its first implementation in the "Fiji" GPU. That design forms the foundation for many of today's system-in-package implementations for AI and high-performance computing across the industry. Bryan also serves as chairman of the Chipletz Board of Directors. 

Jay Owen leads business operations, market positioning, and relationship management for Chipletz. He brings extensive experience taking advanced technology solutions to market. Most recently he was the business lead for securing AMD-based exascale computing systems at Oak Ridge and Lawrence Livermore national laboratories.  

Michael Su oversees research & development, technical strategy, and the development of Chipletz products. His leadership responsibility spans semiconductor interconnects, advanced packaging, silicon packaging integration, advanced passive devices, and manufacturing technology. Formerly a Senior Fellow at AMD, Michael was responsible for all AMD packaging and silicon backend solutions for 20 years.

Jeff Cain leads the design engineering team at Chipletz, focusing on signal and power integrity across the substrate and package. Jeff previously ran a corporate R&D team for AVX, developing a variety of passive component innovations.  Before AVX, he led a system engineering team at Cisco working on switching and routing hardware platforms  

MeeLan Lee leads power architecture development for Chipletz, engineering new solutions to solve power distribution in existing systems. MeeLan joined from Google, where she grew the analog and silicon product engineering teams, including  a hardware team at Google ATAP. Prior to Google, she worked at Atheros, where she led development of six generations of CMOS radios for Wi-Fi and Bluetooth. MeeLan's ten years at  Atheros saw the startup grow to over one billion dollars in yearly revenue and an acquisition by Qualcomm. 

Mike Alfano leads product engineering at Chipletz, focusing on manufacturability and high-volume production.  His leadership responsibilities span productizing engineering prototypes, high-volume test, yield attainment, production readiness, and cost containment.  Formerly a Fellow at AMD, Mike was responsible for end-to-end product manufacturing feasibility and execution for AMD's industry leading 2.5D graphics and chiplet-based server products.