Chipletz makes integration of virtually any die from any manufacturer a possibility.

Continuing to deliver on the promise of steady, predictable performance gains is the challenge facing the semiconductor industry today. Higher raw material costs and lower yield percentages are changing the economics of semiconductor manufacturing. Die sizes are reaching maximum feasible dimensions and advanced nodes are incompatible with the integration of desirable functions like memory, optics, and analog circuits. All the while, the demand for performance continues to grow. 

Chipletz was formed by a team of skilled engineers with decades of experience in semiconductor design, manufacturing, and packaging to address that need. Chipletz is pushing the system-in-package concept into the future and offering a path forward that will enable years of additional performance increases while resetting the economic model for semiconductor integration.